Xiaomi CR6609, about $20. CR6609 is a custom version, there is a model CR6608, also a custom version, I guess both hardware chip the same. Take it apart today and take a look! This one only the body, no power!
All black appearance.
The top shell is a hollow design, which is very beneficial to enhance heat dissipation, and the Redmi AX5 and AX6 are also designed in this way. But this design has advantages and disadvantages, the disadvantage is that when you accidentally splash water on the surface of the body, it may be broken!
Fuselage bottom label.
Four Gigabit LAN ports on the back, 1WAN+3LAN.
Unpacking the housing.
A large piece of aluminum heat sink covers most of the motherboard.
The aluminum version is 3mm thick, Xiaomi has never been attentive to heat dissipation design, even for the carrier’s customized version is not sloppy, praise a.
Remove the heat sink.
Heat sink with a small piece of EMI shielding foam with adhesive on one side.
No chip on the back of the motherboard, the antenna is welded to the motherboard, there is a very short, so this angle is the limit:
Removing the shield on the front of the motherboard, the memory and CPU have heat-conductive silicone pads.
CPU model is MT7621AT, dual-core 880MHz, integrated five-port gigabit network port.
Below the CPU is the memory chip, model number is M15T2G16128A, capacity 256MB, DDR3.
To the right of the CPU is the flash memory chip, model number is F59L1G81MB, capacity 128MB.
The wireless chip is MT7905DAN+MT7975DN, forming “MT7915D”. 2.4G and 5G both support 2x2mimo, 2.4G maximum rate of 574Mbps, 5G maximum rate of 1201Mbps.
There is no external FEM chip.
DC power input circuit.
There is nothing else to see, so to this Xiaomi CR6609 disassembly is complete, the chip summary chart is as follows.
Xiaomi 4C in the downstairs D point measurement speed of more than 70Mbps, Xiaomi 11 on about 120Mbps, the speed is considered poor.
Standby power 5.9W, MT7975DN + MT7905DAN heat generation is considered large, but there is this large heat sink, plus the top cover has a skeleton heat sink holes, so this body heat appears small.
The three major chips of AX1800 program, BCM6755 standby power is the lowest, the least heat, usually i BCM program 5G is to have an independent FEM chip, the signal will be stronger than these MTK program without external FEM (signal and speed).
Qualcomm’s AX1800 is the best overall quality in the three major programs. From the heat and signal quality Qualcomm’s AX1800 is better than the other two.