The wireless parameters described on the MX4050 box are AX3000, which means 2+2+2 (600+1200+1200 Mbps), but I think the real one is 600+1200+2400 Mbps, and I saw a lot of people on some websites saying that the MX4050’s two 5Gs are only 2×2, so after dismantling the machine I used real tests to prove that the MX4050 has one 5G that is 4x4mimo 2402Mbps. MX4050 has a 5G is 4x4mimo 2402Mbps. casually also test its USB3.0 read and write speed.
MX4050 and MX5300 appearance and construction as well, very complex and delicate, the whole disassembly process feels very pleasant, disassembly can also bring pleasure, rarely. Pictures and text descriptions will be a lot, do not want to look at the lowest can be pulled directly to see the summary, if you do not want to waste energy to pull the bottom also want to know the summary, then I can tell you now, it is worth.
Open the outer packaging of MX4050.
The box is as big as the MX5300, but it will be significantly lighter than the MX5300, how much lighter? We’ll weigh it later.
Take out the body power and network cable.
British power plug, it does not matter, I have a conversion head, no matter, DC plug is the regular 5521 specifications.
Power output specifications 12V/3A, very adequate power output.
Weighing the MX4050 body, 953 grams, the MX5300 weighs 1163 grams, a difference of 210 grams. Compared to the MX5300 is lighter, but than than most other wireless routers is full of hands.
Take out the MX5300 to compare the appearance, can you tell the difference?
Do not look at the back of the interface is indistinguishable from the MX5300 less than a LAN port:
Interfaces: 1x WAN+3x LAN, full Gigabit, 1x USB3.0
Open, according to MX5300 dismantling experience, first disassemble the top of the fuselage cooling hole cover. Inserted with force to pry open.
The top cover is taken off.
There are four screws at the top, not unscrewed first, now go to the bottom of the demolition, the bottom of the label torn open to reveal four screw threads, remove the screws:
The bottom cover can be easily taken away:
At this point, set the body, the top four screws down, holding the white shell with one hand to lift up, so as to separate the shell and the main components:
One side of the main body.
Here are four antennas, the motherboard printed with the initials of the color, g gray, b black, R red, W white. Installed back when not afraid to get it wrong.
There are also three antennas on the top.
Topmost antenna structure body.
The field antenna in the middle of the picture above is a separate Bluetooth antenna, other antennas in the back of the disassembly will be separately explained which one is which.
The largest aluminum heat sink has four screws, unscrew the screw thread after the heat sink and motherboard separation. The heat sink in the picture below has three pieces of heat-conductive silicone pads, the square is the CPU, the two small rectangles must be the memory, look at the shape is very similar.
Turn to the other side, there is a heatsink, pry it open, so that it is separated from the motherboard. In the picture below, this heatsink is in contact with the motherboard in several places with the heat-conducting silicone pads, and the largest silicone pad is at the bottom of the CPU. Thus, it seems that both sides of the CPU have good thermal conductivity and heat dissipation.
The main board is separated from the main frame in the picture below, I reversed the order of this step, should first remove the top of the antenna structural components. Otherwise, the motherboard is stuck at both ends is difficult to take out, tossed a long time to take out the motherboard. The main frame, MX5300 with aluminum, this one is not like metal, very light and very hard.
In fact, the top antenna structural member is closely connected to the motherboard by two catches, one on each side.
Removed the antenna structural parts.
For the time being, it is broken down as follows.
Two heat sinks on both sides of the motherboard.
I call the front of the motherboard on the side where you can see the mesh.
On the other side is the back of the motherboard.
The motherboard can be seen with multiple metal shields on both sides. I forgot to measure the size of the motherboard.
From the front of the motherboard to look at the hardware chip, pry open the shield after the look: (ask everyone: is there a special tool to remove the shield?)
The CPU and two memory chips also have heat-conductive silicone pads on them, which are inevitable, otherwise how can they conduct heat to the heatsink.
CPU, memory, three wireless chips, switch chips are on this side, then come to look at each chip model.
CPU model is Qualcomm’s IPQ8174, quad-core A53 architecture, frequency 1.4GHz, supports up to 8 spatial streams (8×8), and in the case of tri-band wireless, it can be distributed like this: 2x2mimo 2.4G + 2x2mimo 5G1 +4x4mimo 5G2.
Parameters of IPQ8174.
CPU Clock Speed: Up to 1.4 GHz
CPU Cores: 4x ARM Cortex A53
Process Technology: 14 nm FinFET
Wi-Fi Standards: 802.11ax, 802.11ac, 802.11a/b/g, 802.11n
Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
Spatial Streams: Up to 8
Peak speed: 4.1 Gbps
Wi-Fi Features: 1024 QAM, Advanced QoS, MU-MIMO,
OFDMA, Uplink scheduling, TxBF,
Qualcomm® Wi-Fi SON
Supports Qualcomm’s private protocol: Wi-Fi SON, which enables automatic device configuration, management, detection and repair of Wi-Fi connections, while optimising end-to-end performance in Wi-Fi networks and providing a better connectivity experience for users. Simply put, it supports MESH networking.
The IPQ8174 is part of the Networking Pro 800 Platform family.
Memory model: M15T2G16128A, capacity 256MB, there are two composed of 512MB RAM.
There is a Gigabit switch chip under the network port, model QCA8075 from Qualcomm, which supports a five-port Gigabit rate. CPU IPQ8174 is connected to QCA8075 with a PSGMII interface, which has an interface bandwidth of 6.25Gbps, so there is no bottleneck even if five network ports send data to the CPU at the same time. (Data exchange within the network ports is not required with the interface.)
Now look at the three wireless chips.
The figure below shows one of the 5G RF circuits, the wireless chip model is QCN5054, the “5” in “54″ represents 5GHz, “4” represents 4x4mimo. 2402Mbps is the highest rate. It belongs to 5G2 in the system. there are four independent FEM chips (amplifiers) outside the chip. There are small green squares on the right of the amplifier, which are filters.
The FEM chip model is SKY85755-11 with integrated PA and LNA.
The parameters of SKY85755-11 are as follows.
Integrated 802.11ax , 5 GHz PA, LNA with bypass, and T/R
Fully-matched input and output
Integrated logarithmic power detector and directional coupler
Transmit gain: 32 dB
Receive gain: 14 dB
MCS11, +18 dBm, –43 dB EVM
MCS9, +20.5 dBm, –35 dB EVM
MCS7, +22.5 dBm, –30 dB EVM
Wi-Fi 6 mode power amplification parameters: +18 dBm, -43 dB EVM
On the other side there is a 5G wireless chip: LQCN5054, the amplifier chip is also SKY85755-11, also with filter. Here QCN5054 is designed for only two RF channels, supporting 2x2mimo, 5G maximum rate 1201Mbps. it belongs to 5G1 in the system.
Why do both 5G of a tri-band wireless router need to have a filter? Because it can prevent the signal of one 5G band from interfering with the other 5G band, and the two 5G do not interfere with each other.
The model number of 2.4G wireless chip is QCN5024, the 2 in front of “24” represents 2.4GHz, the 4 behind represents 4x4mimo, only two RF channels are designed here, so 2.4G is 2x2mimo, the maximum rate of 573Mbps. two external FEM chips, model number is SKY85340-11, integrated with PA and LNA.
The power output parameters of SKY85340-11 are as follows.
MCS11，HT20-HT40，-43 dB DEVM +21 dBm
MCS9，HT20-HT40，-40 dB DEVM +22 dBm
MCS9，HT20-HT40，-35 dB DEVM +23 dBm
Output power in Wi-Fi 6 mode +21 dBm -43 dB DEVM
A summary diagram of all the chips on the front of the motherboard is as follows.
There is a USB 3.0 port next to the network port.
USB read and write speeds are as follows.
The test is 32G SLC cottage USB drive, directly under the win share move a single file, read and write speed are 113MB / s, reached the limit of the gigabit network port. This read and write speed is very suitable for acting as a private cloud, NAS, Blu-ray video and audio shared playback, file backup.
Now you can turn over the motherboard to see the chip situation on the back, after the shield are pried open look like.
Zoom in to see that there are three small chips.
There is a power management chip in the middle, the model is Qualcomm’s PMP8074, mainly responsible for the power supply of the CPU.
There is a flash memory chip on the left, model number FMND4G08S3K-ID, with a capacity of 512MB.
There is also a small Bluetooth chip, silk-screened with “MG21 A020JI B01HGM”, the model may be EFR32MG21.
Low Power Wireless System-on-Chip
High-performance 32-bit 80MHz ARM Cortex®-M33 with DSP instructions and floating-point unit for efficient signal processing
Up to 1024kB of Flash program memory
Up to 96kB of RAM data memory
2.4GHz radio operating frequency
TX power up to 20dBm
The role of Bluetooth, one is used when the phone is set up a new device, and the second is used for communication when multiple routers are grouped together. Guess.
Back of the motherboard chip summary chart.
basically dismantled, now you can go to understand the distribution of the antenna
inside the blue circle is a dual-band antenna with two pieces.
Inside the red circle is the single-band 5G antenna of 5G2, there are two pieces, but each piece has a PCB antenna on the front and back, so these two antennas form a 4T4R antenna. The following figure, composed of X antenna. The first time to see such a design.
The IPQ8174 is not as high frequency as the IPQ8072A and naturally generates much less heat.
At this point, the MX4050 teardown is complete and the hardware configuration is IPQ8174+QCN5024+QCN5054+QCN5054+512MB RAM+512MB Flash.
From the hardware point of view the 5G2 is indeed 4x4mimo, the highest rate is 2402Mbps. the total rate is 4176Mbps. now to prove that the 5G2 is not 2x2mimo.
Using a 4x4mimio wireless card, WDN8280, 802.11ac, connected to the MX4050’s 5G2, the rate shown is 1.7Gbps.
1.7Gbps connection rate already indicates a 4x4mimo, run a speed with IxChariot to see the results as follows, a very smooth run of 944Mbps, which is the bottleneck of the network port.
Then use the XDR6060 wireless bridge to MX4050 5G2, speed measurement results have 1417Mbps, if the 5G2 is only 2x2mimo 1201Mbps words, there will not be this speed run out.
Looked at the wireless NSS with winfi, which is 2+2+4, and 5G2 is definitely 4x4mimo.
I conclude that the MX4050 is the MX4200, the same hardware, the same wireless parameters, 5G2 are 4x4mimo 2402Mbps.
The MX4050 is more expensive than the MX4200, such materials and workmanship, plus a 3-year warranty, worth it.
The benefits of the tri-band router, in addition to the conventional benefit of wireless networking speed, there is a great benefit: two 5G classification connection use.
You can connect some WIFI5 devices to one 5G and WIFI6 devices to another 5G, so that the WIFI5 devices do not slow down the WIFI6 devices.
You can also connect your game playing devices to one 5G and other devices in your house to another 5G, when no one interferes with your 5G WIFi and play more stable games.
These prerequisites are to be able to freely set the wireless name, 5G to change two different names to facilitate the categorization of the connection, those who can not split the frequency will be very troublesome 。。。。 So I’ve never recommended dual-band in one.