The cheapest switch with 4 2.5G network interfaces I’ve found so far is the TP-LINK switch model TL-SH1206, the 6 behind it represents a total of 6 network ports, and also comes with 2 10G fiber ports.
Now take it apart and see what chip it is! I’m very well grounded chi.
Kraft carton outer packaging, nothing to see, directly open the packaging:
All accessories are as follows.
It also comes with a pair of lugs that fit into the cabinet. The cabinet can hold switches, main routes, NAS, etc. Because of this last advantage, I bought a 9U cabinet.
The length of the body 25CM.
Signal light panel.
There is a VLAN isolation switch, 4 network ports can not interoperate, but the 2.5G network interface can interoperate with the 10 Gigabit fiber interface, the manual says so.
Take out the Netgear XS508M and SH1206 from the cabinet and put them together to compare.
The XS508M can be connected via their respective 10 Gigabit fiber ports, allowing the XS508M to be expanded with four 2.5G ports.
Disassembling the iron case.
AC-DC power supply installed inside, there are two 16V 680 microfarads capacitors, DC output only see 1.5A, fixed glue covered some words, from the capacitor voltage 16V can guess the output specification is 12V/1.5A, about this power enough, the subsequent simple test will measure the power in various states. I think it is certainly very sufficient. Only two chips well!
Only want to dismantle the motherboard, no, because the information panel connector and power cable connector has a fixed adhesive, and two DC power cable soldered to the motherboard. So then, all can be dismantled out of it. The most simple and effective stupid way .
There is a piece of plastic at the bottom of the power board to prevent a short circuit with the iron case.
All taken out.
The motherboard has two very tall and thick aluminum heat sinks.
The bottom is the switch chip, it seems to be a chip responsible for a group of four 2.5G ports to connect, and another responsible for two 10G fiber ports. Four 2.5G interfaces correspond to four network transformers.
The bottom of the motherboard, the circuitry and components at the bottom of the two chips are not the same, certainly not the same chip model.
Sure is DC 12V/1.5A.
Both heat sinks are soldered to the motherboard, trouble:
Many capacitors on the motherboard, a larger capacitor is 25V 470 microfarads, other forget. Between the heatsink and the chip is estimated to use a thermal conductive silicone adhesive, more trouble. How not to get into the heatsink with screws and use the thermal conductive silicone pad it.
Comprehensive consideration of the risk of breaking is relatively high, so the dismantling of the machine ends here. Roll!!! How to call the disassembly without seeing the chip!
Decided to first use the hair dryer to heat the heat sink, after a complex addition and subtraction to calculate the angle and distance and the length of time, so that the temperature of the heat sink to reach the feeling of hot hands on the right. Then use the electric contact iron to 380 degrees, on the tin, a hand holding the heat sink to rip off with force.
The soldered position is cleaned up with a solder suction device, so that it is easy to install back after the job is done.
The writing on the two chips is completely invisible, and the surface is not well cleaned by the cured adhesive.
Use a blade to slowly scrape clean a little bit, can show the model number of characters on the good.
First look at the switch chip connected to the 10 Gigabit fiber port, the model is BCM53161XU. (Ultra-Low Power Layer2 GE/FE Switch with 10G Uplinks)
The parameters of the BCM53161XU are as follows.
ARM Cortex-M7 at up to 400 MHz.
Operational mode: Unmanaged.
Up to 4×SGMII ports for 1GE/2.5GE connectivity.
Up to 2×10G XFI with KR support.
1 × RGMII.
16K entry MAC address table.
1K multicast group support.
128 KB packet buffer.
srTCM and trTCM meters (support color aware and color blind modes).
Eight CoS queues per port with priority flow-control.
IEEE 802.1p, MAC, and DSCP packet classification.
Auto Loop detection.
Auto IGMP snooping.
1K packets and bytes counters.
IEEE 802.3az Energy Efficient Ethernet (EEE).
Jumbo frame support: up to 9728 bytes.
425-pin, 19×19 mm2 FBGA package.
Includes one UART and MDIO interface, seven I2C interfaces, and 16 GPIOs (via the MFIO).
Simple schematic of the bus interface.
Support for 2 XFI strips summarized at 10Gbps each.
Support 4 bars SGMII+, each rate is 2.5Gbps.
Weiliancom QSW-1105-5T is a pure five-port 2.5G switch, with the same series of chips, the chip model is BCM53161XM, this chip to external 2.5G Ethernet PHY chip. Taobao has for sale, to 999 yuan, and TP this same price, more than a 2.5G port but less 2 10G optical port, obviously TP this more cost-effective.
Why Broadcom’s WIFI6 router does not put this one BCM53161XU to support 10 Gigabit network port ah? Because in 2016 the design of the BCM4908 has only one SGMII+ bus, so it can only have a 2.5G network port. If you want to support 5G and 10G network ports, Broadcom’s future CPUs have to support PSGMII and XFI bus. Am I right?
The other chip model is BCM54994EB0KFSBG, 17x17mm Quad, 2.5G PHY C-temp w/ HS. Can’t find more details.
Translated with www.DeepL.com/Translator (free version)
The following is the flash memory chip connected to the BCM54994EB0KFSBG, model number GD25LQ80CSIG, with 1MB capacity.
The following is the flash memory chip connected to the BCM53161XU, model number GD25Q80CSIG, also with a capacity of 1MB.
The following is a chip summary diagram of the SH1206 motherboard.
Finally the chip is coated with silicone grease and soldered to install the heat sink.
This completes the disassembly of TP-LINK’s SH1206 switch.